Experienced high-speed PCB design and layout engineering is a major requirement for correctly partitioning a BGA on a PCB. Ideally, this expertise should be inextricably intertwined among chip vendors ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

In some designs where electro-magnetic interference (EMI) is a concern, the external layer or top layers aren’t used to route even the outer periphery. In that case the top layer is used for a ground ...