Abstract: Insulated gate bipolar transistor (IGBT) modules are key components in power electronic converters. The wire-bond packaging failures of IGBT module, such as bond wire related failures, will ...
Abstract: The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network ...
In recent years, with the rapid development of new energy vehicles, IGBT, as the main cost component of the controller for new energy vehicles, has also ushered in an outbreak. It is expected that by ...
I have never been very good at introducing topics. During my presentations, I either jump directly into the subject matter, or start with a joke. My mom always said I could be a stand-up comedian. I ...
System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
A lack of planarity along the interface between the solder and the ceramic raft in an IGBT module is a common anomaly that can make heat dissipation uneven across the die and cause the die to crack.
Mitsubishi Electric is to start sampling a 1200V IGBT power module for industrial applications. The LV100 will start sampling on 15 th February for solar and other renewable-energy power-supply ...
At PCIM Europe, Power Integrations announced the SCALE EV family of gate-driver boards for Infineon EconoDUAL modules. The SCALE EV family consists of automotive-qualified, dual-channel plug-and-play ...
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