Aimed at portable devices such as camera phones, the 6.1 x 6.3-mm OV3630 3.2-Mpixel CMOS image sensor module has a 2,048 x 1,536 array of 2.2-µm pixels and a 1/3.2-in. lens format. The device's 10-bit ...
Trending News and Industry Insights on the CMOS Image Sensor Module Market The CMOS Image Sensor Module Market is experiencing rapid growth driven by technological advancements, increasing adoption ...
Phase One has just announced three new additions to their range of IQ backs: the Phase One IQ180, IQ160, and IQ140. These professional sensor modules are designed to fit on the back of medium format ...
The "Germany CMOS Image Sensor Module market" decisions are mostly driven by resource optimization and cost-effectiveness. Demand and supply dynamics are revealed by market research, which supports ...
TOKYO--(BUSINESS WIRE)--Toshiba Corporation (TOKYO:6502) announced today that the launch of "CIPS183BS210", a Contact Image-Sensor Module with a faster data rate, for application in banknote ...
Toshiba Corporation announced that the launch of CIPS183BS210, a Contact Image-Sensor Module with a faster data rate, for application in banknote recognition systems. Mass production is scheduled to ...
A new color contact image sensor module has been designed with 102 mm read-width and 5.0 MHz maximum pixel rate. The PI630MC-A6C sensor has a photo-site density of 23.64 mm and a pixel ...
Lite-On Semiconductor, a Taiwan-based vendor of CMOS image-sensors and other discrete ICs, has begun volume shipments of its 1.3-megapixel CMOS image-sensor modules, made using a chip-on-board (COB) ...
Sony is reported to have entered small-scale production of CIF (common interchange format) CMOS (complementary metal-oxide semiconductor) image sensor modules recently and be planning to launch VGA ...
San Jose Calif. — The TCM8230MD is a VGA-class CMOS image sensor camera module specifically optimized for mobile phone architectures. This module can produce 330,000 pixels that can be arranged in a ...
Toshiba Corporation announced that the launch of CIPS183BS210, a Contact Image-Sensor Module with a faster data rate, for application in banknote recognition systems. Mass production is scheduled to ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results