IEEE

The Research on Formal Verification of CPU Structure Based on Theorem Proving

Abstract: With the development of SOC technology, the structure of today's CPU is very complex, conventional design and verification methods such as testing and simulating can't guarantee the ...
Digi Times

Ultrabook, new CPU structure expected to be main focuses of IDF in September

CPU maker Intel is set to host its Intel Developer Forum (IDF) show in San Francisco from September 13-15 and its plans for ultrabook, upcoming Ivy Bridge- and Haswell-based processors as well, as its ...
IEEE

Development of large-size CPU package structure using embedded thin film capacitor substrate

Abstract: This paper reports on a large-size CPU package for UNIX servers which employs embedded thin film capacitor layers. The substrate of this package has two thin film capacitor layers in the ...