Announcing a new publication from Opto-Electronic Technology; DOI 10.29026/oet.2026.250014. Driven by the rapid proliferation of Artificial Intelligence (AI) and High-Performance Computing (HPC), ...

Optical interconnects, leveraging intrinsic advantages such as high bandwidth, low loss, and immunity to electromagnetic interference (EMI), are thus regarded as a promising solution to these barriers ...

For AI and HPC processors, performance depends not only on transistor density, but also on memory bandwidth, I/O density, ...

Thousands of attendees gathered at ECTC to explore the latest advances in advanced packaging, AI-driven design, heterogeneous integration and thermal management. More than 2,700 attendees conversed ...

IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...

Builds integrated photonics lab to ramp research and development for proprietary optical processing unitSan Francisco, June 30, 2026 (GLOBE ...